Verification of Integrated Circuits and Systems (ILV)

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Course lecturer:

 Johannes Gratzer , BSc
 Martin Hofer
 Stefano Roggi
 Aidan Taylor
Course numberM2.02840.30.011
Course codeVerificati
Curriculum2023
Semester of degree program Semester 3
Mode of delivery Presencecourse
Units per week3,0
ECTS credits5,0
Language of instruction German

  • Students know the main aspects related to test and measurements of electronic components for mass production and characterization.
  • They understand in detail how a modern Automatic Test Equipment is made and how to use it for the development of test applications.
  • They have knowledge of digital and mixed-signal test requirements and test methods for the most common IPs found in modern microcontrollers.
  • They can apply data analysis and techniques for control and optimization of industrial testing of electronic components.
  • They can explain the concept of failure analysis for semiconductor devices.
  • They are able to understand the basic analysis flow for failure analysis jobs and analytical services.
  • They are familiar with different state of the art methods and tools for semiconductor characterization and their fields of application.
  • They are aware of different approaches for visualization, physical and chemical characterization of microstructures.
  • They can apply their knowledge to characterize an analog-to-digital converter test chip from their ISCD project.

ILV "Introduction to Integrated Circuits Design Project"
ILV "Design and Implementation of Analog Circuits and Systems"
ILV "Design and Implementation of Digital Circuits and Systems"

Automatic testing and measurements of semiconductor components

  • Introduction to Industrial Testing
  • Automatic Test Equipment (ATE)
  • Test Hardware
  • Basic ATE testing
  • DfT and DSP-based testing
    • Design for Test (DfT)
    • DPS-based testing
    • Analog channel testing
    • Measurement errors
  • Mixed-signal testing (part I)
    • ADC and DAC testing
    • Measurements on ADDA test chip
  • Mixed-signal testing (part II)
    • Power Management System testing
    • Measurements on ADDA test chip
  • Digital, memory and HS interface testing
    • Digital testing
    • SRAM and FLASH Memory testing
    • HS interfaces testing
  • RF testing, data processing and analysis
    • RF testing
    • Data collection and processing
    • Data correlation
    • Yield analysis / Testing efficiency
The basic principles of physical and electrical failure analysis in semiconductor components
  • When device testing detects a failure
    • Methods for replicating device fails in the lab
    • Using electrical data to form a fail hypothesis
    • Methods for localizing device failures
  • Non-destructive testing of devices
    • Optical microscopy
    • X-ray microscopy
    • Scanning acoustic microscopy
  • Device delayering and inspection
    • Chemical methods for delayering
    • Physical methods for delayering
    • Scanning electron microscopy
    • Scanning probe microscopy (AFM etc.)
  • Destructive material analysis
    • Secondary Ion mass spectroscopy
    • Focused ion beam microscopy
    • Transmission electron microscopy
Practical lab work: test and characterization of ADC from students' projects
  • Preparation and delivery of measurement plan
  • MATLAB routines for data evaluation
  • Chip measurement
  • Comparison of measurement results with expected behavior from simulation

Lecture material as provided in the course (required)
Recommended reading as follows:

  • M. Burns, G. Roberts, An Introduction to Mixed-Signal IC Test and Measurements, Oxford University Press, 2011.
  • M. Bushnell, V. Agrawal, Essentials of Electronic Testing for Digital, memory and Mixed-Signal VLSI circuits, Springer, 2000.
  • K. B. Schaub, J. Kelly, Production Testing of RF and System on a Chip Devices for Wireless Communication, Artech House Publishers, 2004.
  • L. C. Wagner, Failure Analysis of Integrated Circuits: Tools and Techniques, The Springer International Series in Engineering and Computer Science, 494, 1999.
  • L. A. Giannuzzi, F. A. Stevie, FIB: Introduction to Focused Ion Beams, Springer, 2005.
  • J. I. Goldstein et al., SEM/EDS: Scanning Electron Microscopy and X-Ray Microanalysis, Springer 2018.
  • D. B. Williams, C.B. Carter, TEM: Transmission Electron Microscopy, Springer 2016.
  • IEEE Standard for Terminology and Test Methods for Analog-to-Digital Converters.
  • Advantest V93k ATE, Training Material provided by the Instructor.

Teaching & discussion, problem assignments, practical lab work using measurement tools, homework

Integrated module examination
Immanent examination character: Written/oral exam, including homework assignments, presentations and lecture contribution