Lecture | Type | SPPS | ECTS-Credits | Course number |
---|---|---|---|---|
Databases and Data Structures | ILV | 3,0 | 5,0 | B2.09090.20.071 |
Lecture | Type | SPPS | ECTS-Credits | Course number |
---|---|---|---|---|
Master Thesis | MT | 0,5 | 25,0 | M2.05280.40.011 |
Master Thesis Seminar | SE | 2,0 | 2,0 | M2.05280.40.021 |
Specialization Area: Electronic Systems | Type | SPPS | ECTS-Credits | |
Signal and Data Processing | ILV | 3,0 | 5,0 | M2.05282.20.071 |
Lecture | Type | SPPS | ECTS-Credits | Course number |
---|---|---|---|---|
Signal Processing 1 | ILV | 2,0 | 2,0 | B2.05270.20.080 |
Lecture | Type | SPPS | ECTS-Credits | Course number |
---|---|---|---|---|
Signal Processing 1 | ILV | 2,0 | 2,0 | B2.05270.20.080 |
Lecture | Type | SPPS | ECTS-Credits | Course number |
---|---|---|---|---|
Signal Processing 1 | ILV | 2,0 | 2,0 | B2.05270.20.080 |
Lecture | Type | SPPS | ECTS-Credits | Course number |
---|---|---|---|---|
Introduction to Programming and Computer Science | ILV | 3,0 | 5,0 | B2.09090.10.061 |
Orientation and Outdoor Project | UE | 3,5 | 5,0 | B2.09090.10.011 |
Lecture | Type | SPPS | ECTS-Credits | Course number |
---|---|---|---|---|
Signal and Data Analysis | ILV | 3,0 | 5,0 | M2.05280.10.041 |
Lecture | Type | SPPS | ECTS-Credits | Course number |
---|---|---|---|---|
Signal and Image Processing | ILV | 3,0 | 4,0 | B2.05270.30.120 |
Lecture | Type | SPPS | ECTS-Credits | Course number |
---|---|---|---|---|
Signal and Image Processing | ILV | 3,0 | 4,0 | B2.05270.30.120 |
Lecture | Type | SPPS | ECTS-Credits | Course number |
---|---|---|---|---|
Signal and Image Processing | ILV | 3,0 | 4,0 | B2.05270.30.120 |
Signal and Image Processing | ILV | 3,0 | 4,0 | B2.05270.30.120 |
Titel | Autor | Jahr |
---|---|---|
High-Quality Delta-Sigma Oscillators for BIST Circuits | Metin Oktay YILMAZ | 2025 |
Advancing CMTI Test bench Performance with Pulse Detection and Synchronization | Kristina Đorđević | 2024 |
Development of Measurement Setup for Quartz Dome Geometry and Investigation of Influence on Uniformity of Processed Wafers | Alexander Funk | 2023 |
ADC performance prediction based on FFT and Machine Learning algorithms | Kristian SHYTI | 2022 |
Analysis & Verification Evaluation of Bluetooth Low Energy Technology in Accordance with the SIG Specification Procedure | David Gjorgjevski | 2022 |
Analysis of Machine Learning Models for Jitter Classification & Real-Time Prediction | Vlad-Teodor Frincu | 2021 |
Implementation and Development of a Universal Test Set-up for FPD-Link Applications | Akram Mohsen Ibrahim Saber IBRAHIM | 2020 |
Optimization of a Watermark Based OHT Vehicle Management Policy | Peter Por | 2020 |
Simulink modeling of a silicon microphone digital filter path for automated code generation | Noura DEEB | 2020 |
Concept of a system to "Track and Recall Diver In Submersion" (T.A.R.D.I.S.) | René Wally | 2018 |
Evaluation of Beamforming Algorithms in Voice Assistant Devices | Michael Adolf Lamp | 2018 |
Gesture sensing based on multiple infrared proximity sensors using neural networks | Raffael Tschinder | 2018 |
Detection of high frequency mechanical vibrations of SAW devices using a low IF receiver architecture | Aoun Amin AWAN | 2017 |
Digital compensator for thermal acoustic distortions | Eda SEVIM | 2017 |
Peeling application in the kitchen | Igor ANES ROMERO | 2016 |
Simulation of a Multilayer Air-Cored Coil for an Electromagnetic Impact and Compression Test System | Alexander Jöbstl | 2014 |
Concept for Fast Phase Analysis of SAW Delay Lines | Ernst Christian Gruber | 2011 |
Analysis of RF-Interferences and Development of Coexistence Strategies for 2.4 GHz SAW Interrogation Systems in WLAN and Bluetooth Environments | Katrin Lukan | 2010 |
Spatial Fourier analysis of optical dispersion in optical fibers and photonic waveguides | Zeinab Amin-Akhlaghi | 2010 |
Titel | Autor | Jahr |
---|---|---|
High-Quality Delta-Sigma Oscillators for BIST Circuits | Metin Oktay YILMAZ | 2025 |
Titel | Autor | Jahr |
---|---|---|
Advancing CMTI Test bench Performance with Pulse Detection and Synchronization | Kristina Đorđević | 2024 |
Titel | Autor | Jahr |
---|---|---|
Development of Measurement Setup for Quartz Dome Geometry and Investigation of Influence on Uniformity of Processed Wafers | Alexander Funk | 2023 |
Titel | Autor | Jahr |
---|---|---|
ADC performance prediction based on FFT and Machine Learning algorithms | Kristian SHYTI | 2022 |
Analysis & Verification Evaluation of Bluetooth Low Energy Technology in Accordance with the SIG Specification Procedure | David Gjorgjevski | 2022 |
Titel | Autor | Jahr |
---|---|---|
Analysis of Machine Learning Models for Jitter Classification & Real-Time Prediction | Vlad-Teodor Frincu | 2021 |
Titel | Autor | Jahr |
---|---|---|
Implementation and Development of a Universal Test Set-up for FPD-Link Applications | Akram Mohsen Ibrahim Saber IBRAHIM | 2020 |
Optimization of a Watermark Based OHT Vehicle Management Policy | Peter Por | 2020 |
Simulink modeling of a silicon microphone digital filter path for automated code generation | Noura DEEB | 2020 |
Concept of a system to "Track and Recall Diver In Submersion" (T.A.R.D.I.S.) | René Wally | 2018 |
Evaluation of Beamforming Algorithms in Voice Assistant Devices | Michael Adolf Lamp | 2018 |
Gesture sensing based on multiple infrared proximity sensors using neural networks | Raffael Tschinder | 2018 |
Detection of high frequency mechanical vibrations of SAW devices using a low IF receiver architecture | Aoun Amin AWAN | 2017 |
Digital compensator for thermal acoustic distortions | Eda SEVIM | 2017 |
Peeling application in the kitchen | Igor ANES ROMERO | 2016 |
Simulation of a Multilayer Air-Cored Coil for an Electromagnetic Impact and Compression Test System | Alexander Jöbstl | 2014 |
Concept for Fast Phase Analysis of SAW Delay Lines | Ernst Christian Gruber | 2011 |
Analysis of RF-Interferences and Development of Coexistence Strategies for 2.4 GHz SAW Interrogation Systems in WLAN and Bluetooth Environments | Katrin Lukan | 2010 |
Spatial Fourier analysis of optical dispersion in optical fibers and photonic waveguides | Zeinab Amin-Akhlaghi | 2010 |
Titel | Autor | Jahr |
---|---|---|
Bestimmen der Linearitätsfehler eines SAR ADCs mit integriertem Selbsttest | 2022 | |
Pipeline ADC Validierung und Messsystem Optimierung | 2022 | |
Dynamic ADC Test Development using NI Equipment | 2021 | |
Gegenüberstellung verschiedener Systeme zur Positionierung in geschlossenen Räumen Bachelorarbeit | 2019 | |
Smart Ski | 2018 | |
Digitale Signalerzeugung mit objektorientierter Programmierung in Matlab | 2016 | |
Evaluierung von Matlab ähnlicher Software wie Octave und SciLab für den Einsatz im Unterricht | 2016 | |
portables Lesegerät für die Inventarisierung in den Standorten des bfi IT-L@Bs | 2016 | |
Test von modulierten Datenübertragungsmethoden über Leistungsnetze- Powerline Transmission | 2016 | |
Übertragung von Zeitzeichen mit Decodierungsbeispiel des DCF77 Signales | 2016 | |
Simulation einer Übertragungsstrecke für digitale Signale im Basisband mit LabVIEW und Emona Datex Board | 2015 | |
Entwicklung einer STC-Nadelkarte zur Überprüfung der Testerplattform MMCi - High Power | 2014 | |
Entwicklung eines Prüfprogrammes für die STC-Nadelkarte zur Überprüfung der Testerplattform MMCi - High Power | 2014 | |
Feasibility study to implement a wafer alignment verification system | 2014 | |
Image Processing and Data Analysis of a Wafer Alignment Verification System | 2014 | |
Erstellung eines Nadelkarten basierten Continuity Checkers für Teradyne Flex Testsysteme | 2010 | |
Installation einer Sputteranlage für Dünnwafer mit speziellem Waferablagesystem und Implementierung eines verbesserten Pumpensystems | 2010 | |
FERNGESTEUERTE SERVOMOTOR-APPLIKATION | 2009 | |
Ressourcen Optimierung durch Energiemonitoring | 2009 | |
Spannungsüberwachung für THB Belastungsequipment | 2009 |
Titel | Autor | Jahr |
---|---|---|
Bestimmen der Linearitätsfehler eines SAR ADCs mit integriertem Selbsttest | 2022 | |
Pipeline ADC Validierung und Messsystem Optimierung | 2022 |
Titel | Autor | Jahr |
---|---|---|
Dynamic ADC Test Development using NI Equipment | 2021 |
Titel | Autor | Jahr |
---|---|---|
Gegenüberstellung verschiedener Systeme zur Positionierung in geschlossenen Räumen Bachelorarbeit | 2019 |
Titel | Autor | Jahr |
---|---|---|
Smart Ski | 2018 |
Titel | Autor | Jahr |
---|---|---|
Digitale Signalerzeugung mit objektorientierter Programmierung in Matlab | 2016 | |
Evaluierung von Matlab ähnlicher Software wie Octave und SciLab für den Einsatz im Unterricht | 2016 | |
portables Lesegerät für die Inventarisierung in den Standorten des bfi IT-L@Bs | 2016 | |
Test von modulierten Datenübertragungsmethoden über Leistungsnetze- Powerline Transmission | 2016 | |
Übertragung von Zeitzeichen mit Decodierungsbeispiel des DCF77 Signales | 2016 |
Titel | Autor | Jahr |
---|---|---|
Simulation einer Übertragungsstrecke für digitale Signale im Basisband mit LabVIEW und Emona Datex Board | 2015 | |
Entwicklung einer STC-Nadelkarte zur Überprüfung der Testerplattform MMCi - High Power | 2014 | |
Entwicklung eines Prüfprogrammes für die STC-Nadelkarte zur Überprüfung der Testerplattform MMCi - High Power | 2014 | |
Feasibility study to implement a wafer alignment verification system | 2014 | |
Image Processing and Data Analysis of a Wafer Alignment Verification System | 2014 | |
Erstellung eines Nadelkarten basierten Continuity Checkers für Teradyne Flex Testsysteme | 2010 | |
Installation einer Sputteranlage für Dünnwafer mit speziellem Waferablagesystem und Implementierung eines verbesserten Pumpensystems | 2010 | |
FERNGESTEUERTE SERVOMOTOR-APPLIKATION | 2009 | |
Ressourcen Optimierung durch Energiemonitoring | 2009 | |
Spannungsüberwachung für THB Belastungsequipment | 2009 |
Run-Time | October/2023 - September/2027 |
Project management | |
Project staff | |
Forschungsschwerpunkt | Bildungsforschung |
Studiengänge | |
Forschungsprogramm | DIGITAL-2022-SKILLS-03-SPECIALISED-EDU, DIGITAL-SIMPLE |
Förderinstitution/Auftraggeber |
The EU Chips Act aims to increase Europe‘s global production share of semiconductors to 20% by 2030, leading to a need for a skilled workforce to support this growth. Additionally, the EU‘s Green Deal initiative focuses on a transition to sustainable and energy efficient technologies, further emphasizing the need for expertise in sustainable chip development and green applications. There is an EU wide shortage of skilled workers in microelectronics. Addressing this shortage will be crucial in meeting the goals of both the EU Chips Act and the Green Deal. Furthermore, the next generation of students is largely interested in contributing to a sustainable environment. Providing them with the opportunity to gain deeper expertise in this field will align their skills with the industry‘s future needs. The proposed project „Green Chips-EDU“ supports the aforementioned goals by addressing the needs and challenges of a green and digital transition in the microelectronics industry. The consortium, made up of 15 key players from 7 EU countries, aims to build an attractive education ecosystem in green microelectronics by integrating the knowledge triangle of excellent education, industries needs and research challenges. The consortium includes 6 Unite! partners working on a harmonized curriculum focusing on energy efficiency and the development of sustainable integrated circuits. The project addresses all objectives from the call by offering a wide range of degree programs including mutual recognition as well as self-standing modules, implementing staff and student mobility, digital learning formats and upgrading infrastructure. About 600 students are planned to receive degrees or certificates in green electronics. In addition, summer schools, sustainability hackathons, learn-repair cafés as well as expert lectures by the partner companies and research institutions are organized to attract and train students to counteract the skills shortage in microelectronics in the EU.
- European Commission (Fördergeber/Auftraggeber)
- Politecnico Di Torino
- Technische Universität Darmstadt
- Universitat Politecnica de Catalunya
- Institut Polytechnique de Grenoble
- Instituto Superior Tecnico
- INESC ID
- Infineon Technologies Austria AG
- KONCAR - ELECTRONICS AND INFORMATICS Inc.
- Silicongate LDA
- JLG Formations
- AEDVICES Consulting
- RUSZ - Verein zur Förderung der Sozialwirtschaft
- BK-Business Konsens OG
- CADENCE DESIGN SYSTEMS GMBH
- STMICROELECTRONICS (ALPS) SAS
- ONG "THE STERN STEWART INSTITUTE"/LYCEE PRIVE SHORGE
- Technische Universität Graz (Lead Partner)
Run-Time | October/2023 - September/2027 |
Project management | |
Project staff | |
Forschungsschwerpunkt | Bildungsforschung |
Studiengänge | |
Forschungsprogramm | DIGITAL-2022-SKILLS-03-SPECIALISED-EDU, DIGITAL-SIMPLE |
Förderinstitution/Auftraggeber |
The EU Chips Act aims to increase Europe‘s global production share of semiconductors to 20% by 2030, leading to a need for a skilled workforce to support this growth. Additionally, the EU‘s Green Deal initiative focuses on a transition to sustainable and energy efficient technologies, further emphasizing the need for expertise in sustainable chip development and green applications. There is an EU wide shortage of skilled workers in microelectronics. Addressing this shortage will be crucial in meeting the goals of both the EU Chips Act and the Green Deal. Furthermore, the next generation of students is largely interested in contributing to a sustainable environment. Providing them with the opportunity to gain deeper expertise in this field will align their skills with the industry‘s future needs. The proposed project „Green Chips-EDU“ supports the aforementioned goals by addressing the needs and challenges of a green and digital transition in the microelectronics industry. The consortium, made up of 15 key players from 7 EU countries, aims to build an attractive education ecosystem in green microelectronics by integrating the knowledge triangle of excellent education, industries needs and research challenges. The consortium includes 6 Unite! partners working on a harmonized curriculum focusing on energy efficiency and the development of sustainable integrated circuits. The project addresses all objectives from the call by offering a wide range of degree programs including mutual recognition as well as self-standing modules, implementing staff and student mobility, digital learning formats and upgrading infrastructure. About 600 students are planned to receive degrees or certificates in green electronics. In addition, summer schools, sustainability hackathons, learn-repair cafés as well as expert lectures by the partner companies and research institutions are organized to attract and train students to counteract the skills shortage in microelectronics in the EU.
- European Commission (Fördergeber/Auftraggeber)
- Politecnico Di Torino
- Technische Universität Darmstadt
- Universitat Politecnica de Catalunya
- Institut Polytechnique de Grenoble
- Instituto Superior Tecnico
- INESC ID
- Infineon Technologies Austria AG
- KONCAR - ELECTRONICS AND INFORMATICS Inc.
- Silicongate LDA
- JLG Formations
- AEDVICES Consulting
- RUSZ - Verein zur Förderung der Sozialwirtschaft
- BK-Business Konsens OG
- CADENCE DESIGN SYSTEMS GMBH
- STMICROELECTRONICS (ALPS) SAS
- ONG "THE STERN STEWART INSTITUTE"/LYCEE PRIVE SHORGE
- Technische Universität Graz (Lead Partner)
Run-Time | October/2023 - September/2027 |
Project management | |
Project staff | |
Forschungsschwerpunkt | Bildungsforschung |
Studiengänge | |
Forschungsprogramm | DIGITAL-2022-SKILLS-03-SPECIALISED-EDU, DIGITAL-SIMPLE |
Förderinstitution/Auftraggeber |
The EU Chips Act aims to increase Europe‘s global production share of semiconductors to 20% by 2030, leading to a need for a skilled workforce to support this growth. Additionally, the EU‘s Green Deal initiative focuses on a transition to sustainable and energy efficient technologies, further emphasizing the need for expertise in sustainable chip development and green applications. There is an EU wide shortage of skilled workers in microelectronics. Addressing this shortage will be crucial in meeting the goals of both the EU Chips Act and the Green Deal. Furthermore, the next generation of students is largely interested in contributing to a sustainable environment. Providing them with the opportunity to gain deeper expertise in this field will align their skills with the industry‘s future needs. The proposed project „Green Chips-EDU“ supports the aforementioned goals by addressing the needs and challenges of a green and digital transition in the microelectronics industry. The consortium, made up of 15 key players from 7 EU countries, aims to build an attractive education ecosystem in green microelectronics by integrating the knowledge triangle of excellent education, industries needs and research challenges. The consortium includes 6 Unite! partners working on a harmonized curriculum focusing on energy efficiency and the development of sustainable integrated circuits. The project addresses all objectives from the call by offering a wide range of degree programs including mutual recognition as well as self-standing modules, implementing staff and student mobility, digital learning formats and upgrading infrastructure. About 600 students are planned to receive degrees or certificates in green electronics. In addition, summer schools, sustainability hackathons, learn-repair cafés as well as expert lectures by the partner companies and research institutions are organized to attract and train students to counteract the skills shortage in microelectronics in the EU.
- European Commission (Fördergeber/Auftraggeber)
- Politecnico Di Torino
- Technische Universität Darmstadt
- Universitat Politecnica de Catalunya
- Institut Polytechnique de Grenoble
- Instituto Superior Tecnico
- INESC ID
- Infineon Technologies Austria AG
- KONCAR - ELECTRONICS AND INFORMATICS Inc.
- Silicongate LDA
- JLG Formations
- AEDVICES Consulting
- RUSZ - Verein zur Förderung der Sozialwirtschaft
- BK-Business Konsens OG
- CADENCE DESIGN SYSTEMS GMBH
- STMICROELECTRONICS (ALPS) SAS
- ONG "THE STERN STEWART INSTITUTE"/LYCEE PRIVE SHORGE
- Technische Universität Graz (Lead Partner)
Run-Time | October/2023 - September/2027 |
Project management | |
Project staff | |
Forschungsschwerpunkt | Bildungsforschung |
Studiengänge | |
Forschungsprogramm | DIGITAL-2022-SKILLS-03-SPECIALISED-EDU, DIGITAL-SIMPLE |
Förderinstitution/Auftraggeber |
The EU Chips Act aims to increase Europe‘s global production share of semiconductors to 20% by 2030, leading to a need for a skilled workforce to support this growth. Additionally, the EU‘s Green Deal initiative focuses on a transition to sustainable and energy efficient technologies, further emphasizing the need for expertise in sustainable chip development and green applications. There is an EU wide shortage of skilled workers in microelectronics. Addressing this shortage will be crucial in meeting the goals of both the EU Chips Act and the Green Deal. Furthermore, the next generation of students is largely interested in contributing to a sustainable environment. Providing them with the opportunity to gain deeper expertise in this field will align their skills with the industry‘s future needs. The proposed project „Green Chips-EDU“ supports the aforementioned goals by addressing the needs and challenges of a green and digital transition in the microelectronics industry. The consortium, made up of 15 key players from 7 EU countries, aims to build an attractive education ecosystem in green microelectronics by integrating the knowledge triangle of excellent education, industries needs and research challenges. The consortium includes 6 Unite! partners working on a harmonized curriculum focusing on energy efficiency and the development of sustainable integrated circuits. The project addresses all objectives from the call by offering a wide range of degree programs including mutual recognition as well as self-standing modules, implementing staff and student mobility, digital learning formats and upgrading infrastructure. About 600 students are planned to receive degrees or certificates in green electronics. In addition, summer schools, sustainability hackathons, learn-repair cafés as well as expert lectures by the partner companies and research institutions are organized to attract and train students to counteract the skills shortage in microelectronics in the EU.
- European Commission (Fördergeber/Auftraggeber)
- Politecnico Di Torino
- Technische Universität Darmstadt
- Universitat Politecnica de Catalunya
- Institut Polytechnique de Grenoble
- Instituto Superior Tecnico
- INESC ID
- Infineon Technologies Austria AG
- KONCAR - ELECTRONICS AND INFORMATICS Inc.
- Silicongate LDA
- JLG Formations
- AEDVICES Consulting
- RUSZ - Verein zur Förderung der Sozialwirtschaft
- BK-Business Konsens OG
- CADENCE DESIGN SYSTEMS GMBH
- STMICROELECTRONICS (ALPS) SAS
- ONG "THE STERN STEWART INSTITUTE"/LYCEE PRIVE SHORGE
- Technische Universität Graz (Lead Partner)
Run-Time | October/2023 - September/2027 |
Project management | |
Project staff | |
Forschungsschwerpunkt | Bildungsforschung |
Studiengänge | |
Forschungsprogramm | DIGITAL-2022-SKILLS-03-SPECIALISED-EDU, DIGITAL-SIMPLE |
Förderinstitution/Auftraggeber |
The EU Chips Act aims to increase Europe‘s global production share of semiconductors to 20% by 2030, leading to a need for a skilled workforce to support this growth. Additionally, the EU‘s Green Deal initiative focuses on a transition to sustainable and energy efficient technologies, further emphasizing the need for expertise in sustainable chip development and green applications. There is an EU wide shortage of skilled workers in microelectronics. Addressing this shortage will be crucial in meeting the goals of both the EU Chips Act and the Green Deal. Furthermore, the next generation of students is largely interested in contributing to a sustainable environment. Providing them with the opportunity to gain deeper expertise in this field will align their skills with the industry‘s future needs. The proposed project „Green Chips-EDU“ supports the aforementioned goals by addressing the needs and challenges of a green and digital transition in the microelectronics industry. The consortium, made up of 15 key players from 7 EU countries, aims to build an attractive education ecosystem in green microelectronics by integrating the knowledge triangle of excellent education, industries needs and research challenges. The consortium includes 6 Unite! partners working on a harmonized curriculum focusing on energy efficiency and the development of sustainable integrated circuits. The project addresses all objectives from the call by offering a wide range of degree programs including mutual recognition as well as self-standing modules, implementing staff and student mobility, digital learning formats and upgrading infrastructure. About 600 students are planned to receive degrees or certificates in green electronics. In addition, summer schools, sustainability hackathons, learn-repair cafés as well as expert lectures by the partner companies and research institutions are organized to attract and train students to counteract the skills shortage in microelectronics in the EU.
- European Commission (Fördergeber/Auftraggeber)
- Politecnico Di Torino
- Technische Universität Darmstadt
- Universitat Politecnica de Catalunya
- Institut Polytechnique de Grenoble
- Instituto Superior Tecnico
- INESC ID
- Infineon Technologies Austria AG
- KONCAR - ELECTRONICS AND INFORMATICS Inc.
- Silicongate LDA
- JLG Formations
- AEDVICES Consulting
- RUSZ - Verein zur Förderung der Sozialwirtschaft
- BK-Business Konsens OG
- CADENCE DESIGN SYSTEMS GMBH
- STMICROELECTRONICS (ALPS) SAS
- ONG "THE STERN STEWART INSTITUTE"/LYCEE PRIVE SHORGE
- Technische Universität Graz (Lead Partner)
Run-Time | October/2023 - September/2027 |
Project management | |
Project staff | |
Forschungsschwerpunkt | Bildungsforschung |
Studiengänge | |
Forschungsprogramm | DIGITAL-2022-SKILLS-03-SPECIALISED-EDU, DIGITAL-SIMPLE |
Förderinstitution/Auftraggeber |
The EU Chips Act aims to increase Europe‘s global production share of semiconductors to 20% by 2030, leading to a need for a skilled workforce to support this growth. Additionally, the EU‘s Green Deal initiative focuses on a transition to sustainable and energy efficient technologies, further emphasizing the need for expertise in sustainable chip development and green applications. There is an EU wide shortage of skilled workers in microelectronics. Addressing this shortage will be crucial in meeting the goals of both the EU Chips Act and the Green Deal. Furthermore, the next generation of students is largely interested in contributing to a sustainable environment. Providing them with the opportunity to gain deeper expertise in this field will align their skills with the industry‘s future needs. The proposed project „Green Chips-EDU“ supports the aforementioned goals by addressing the needs and challenges of a green and digital transition in the microelectronics industry. The consortium, made up of 15 key players from 7 EU countries, aims to build an attractive education ecosystem in green microelectronics by integrating the knowledge triangle of excellent education, industries needs and research challenges. The consortium includes 6 Unite! partners working on a harmonized curriculum focusing on energy efficiency and the development of sustainable integrated circuits. The project addresses all objectives from the call by offering a wide range of degree programs including mutual recognition as well as self-standing modules, implementing staff and student mobility, digital learning formats and upgrading infrastructure. About 600 students are planned to receive degrees or certificates in green electronics. In addition, summer schools, sustainability hackathons, learn-repair cafés as well as expert lectures by the partner companies and research institutions are organized to attract and train students to counteract the skills shortage in microelectronics in the EU.
- European Commission (Fördergeber/Auftraggeber)
- Politecnico Di Torino
- Technische Universität Darmstadt
- Universitat Politecnica de Catalunya
- Institut Polytechnique de Grenoble
- Instituto Superior Tecnico
- INESC ID
- Infineon Technologies Austria AG
- KONCAR - ELECTRONICS AND INFORMATICS Inc.
- Silicongate LDA
- JLG Formations
- AEDVICES Consulting
- RUSZ - Verein zur Förderung der Sozialwirtschaft
- BK-Business Konsens OG
- CADENCE DESIGN SYSTEMS GMBH
- STMICROELECTRONICS (ALPS) SAS
- ONG "THE STERN STEWART INSTITUTE"/LYCEE PRIVE SHORGE
- Technische Universität Graz (Lead Partner)
Contributed to books | ||
---|---|---|
Title | Author | Year |
Resource Management and Network Layer. In: Giambene G. (editor) (Hrsg.), Resource Management in Satellite Networks, S. 243-288, Springer, Berlin | Birnbacher, U., Chai, W.K. (chapter editors) | 2007 |
Optical networks, last mile access and applications. In: Majumdar A., Reicklin J.C. (Hrsg.), Free-Space Laser Communications, S. 273-302, Springer, Berlin | Leitgeb, E., Gebhard, M., Birnbacher, U. | 2007 |
Conference contributions | ||
---|---|---|
Title | Author | Year |
High Reliable Optical Wireless Links in Last Mile Access in: 10th International Conference on Transparent Optical Networks - ICTON, 22-26 Jun 2008, Athen, Griechenland, S. 178-183 | Leitgeb, E., Lösschnigg, M., Birnbacher, U., Schwarz, G. , Merdonig, A. | 2008 |
other Publications | ||
---|---|---|
Title | Author | Year |
Braucht die Technik Frauen? Impulsvortrag, Auftaktveranstaltung femOVE | Birnbacher, U. | 2010 |
other Publications | ||
---|---|---|
Title | Author | Year |
Braucht die Technik Frauen? Impulsvortrag, Auftaktveranstaltung femOVE | Birnbacher, U. | 2010 |
Conference contributions | ||
---|---|---|
Title | Author | Year |
High Reliable Optical Wireless Links in Last Mile Access in: 10th International Conference on Transparent Optical Networks - ICTON, 22-26 Jun 2008, Athen, Griechenland, S. 178-183 | Leitgeb, E., Lösschnigg, M., Birnbacher, U., Schwarz, G. , Merdonig, A. | 2008 |
Contributed to books | ||
---|---|---|
Title | Author | Year |
Resource Management and Network Layer. In: Giambene G. (editor) (Hrsg.), Resource Management in Satellite Networks, S. 243-288, Springer, Berlin | Birnbacher, U., Chai, W.K. (chapter editors) | 2007 |
Optical networks, last mile access and applications. In: Majumdar A., Reicklin J.C. (Hrsg.), Free-Space Laser Communications, S. 273-302, Springer, Berlin | Leitgeb, E., Gebhard, M., Birnbacher, U. | 2007 |