Lehrveranstaltung | Typ | SWS | ECTS-Credits | LV-Nummer |
---|---|---|---|---|
Master Thesis | MT | 0,5 | 25,0 | M2.05280.40.011 |
Master Thesis Seminar | SE | 2,0 | 2,0 | M2.05280.40.021 |
Lehrveranstaltung | Typ | SWS | ECTS-Credits | LV-Nummer |
---|---|---|---|---|
Ingenieurmathematik 2 | ILV | 4,0 | 5,0 | B2.00000.20.010 |
Lehrveranstaltung | Typ | SWS | ECTS-Credits | LV-Nummer |
---|---|---|---|---|
Ingenieurmathematik 2 | ILV | 4,0 | 5,0 | B2.00000.20.010 |
Ingenieurmathematik 2 - Gruppe I | ILV | 4,0 | 5,0 | B2.00000.20.010 |
Ingenieurmathematik 2 - Gruppe II | ILV | 4,0 | 5,0 | B2.00000.20.010 |
Lehrveranstaltung | Typ | SWS | ECTS-Credits | LV-Nummer |
---|---|---|---|---|
Applied Mathematics | ILV | 3,0 | 5,0 | B2.09090.10.031 |
Lehrveranstaltung | Typ | SWS | ECTS-Credits | LV-Nummer |
---|---|---|---|---|
Advanced Engineering Mathematics | ILV | 3,5 | 5,0 | M2.05280.10.021 |
Lehrveranstaltung | Typ | SWS | ECTS-Credits | LV-Nummer |
---|---|---|---|---|
Mathematische Methoden | ILV | 3,0 | 5,0 | M2.06860.10.050 |
Lehrveranstaltung | Typ | SWS | ECTS-Credits | LV-Nummer |
---|---|---|---|---|
Advanced Engineering Mathematics | ILV | 3,0 | 5,0 | M2.05280.10.021 |
Lehrveranstaltung | Typ | SWS | ECTS-Credits | LV-Nummer |
---|---|---|---|---|
Ingenieurmathematik 1 | ILV | 4,0 | 5,0 | B2.00000.10.010 |
Lehrveranstaltung | Typ | SWS | ECTS-Credits | LV-Nummer |
---|---|---|---|---|
Ingenieurmathematik 1 | ILV | 4,0 | 5,0 | B2.00000.10.010 |
Ingenieurmathematik 1 - Gruppe I | ILV | 4,0 | 5,0 | B2.00000.10.010 |
Ingenieurmathematik 1 - Gruppe II | ILV | 4,0 | 5,0 | B2.00000.10.010 |
Ingenieurmathematik 1 | ILV | 4,0 | 5,0 | B2.00000.10.010 |
Titel | Autor | Jahr |
---|
Titel | Autor | Jahr |
---|
Laufzeit | Oktober/2023 - September/2027 |
Projektleitung | |
Projektmitarbeiter*innen | |
Forschungsschwerpunkt | Bildungsforschung |
Studiengänge | |
Forschungsprogramm | DIGITAL-2022-SKILLS-03-SPECIALISED-EDU, DIGITAL-SIMPLE |
Förderinstitution/Auftraggeber |
The EU Chips Act aims to increase Europe‘s global production share of semiconductors to 20% by 2030, leading to a need for a skilled workforce to support this growth. Additionally, the EU‘s Green Deal initiative focuses on a transition to sustainable and energy efficient technologies, further emphasizing the need for expertise in sustainable chip development and green applications. There is an EU wide shortage of skilled workers in microelectronics. Addressing this shortage will be crucial in meeting the goals of both the EU Chips Act and the Green Deal. Furthermore, the next generation of students is largely interested in contributing to a sustainable environment. Providing them with the opportunity to gain deeper expertise in this field will align their skills with the industry‘s future needs. The proposed project „Green Chips-EDU“ supports the aforementioned goals by addressing the needs and challenges of a green and digital transition in the microelectronics industry. The consortium, made up of 15 key players from 7 EU countries, aims to build an attractive education ecosystem in green microelectronics by integrating the knowledge triangle of excellent education, industries needs and research challenges. The consortium includes 6 Unite! partners working on a harmonized curriculum focusing on energy efficiency and the development of sustainable integrated circuits. The project addresses all objectives from the call by offering a wide range of degree programs including mutual recognition as well as self-standing modules, implementing staff and student mobility, digital learning formats and upgrading infrastructure. About 600 students are planned to receive degrees or certificates in green electronics. In addition, summer schools, sustainability hackathons, learn-repair cafés as well as expert lectures by the partner companies and research institutions are organized to attract and train students to counteract the skills shortage in microelectronics in the EU.
- European Commission (Fördergeber/Auftraggeber)
- Politecnico Di Torino
- Technische Universität Darmstadt
- Universitat Politecnica de Catalunya
- Institut Polytechnique de Grenoble
- Instituto Superior Tecnico
- INESC ID
- Infineon Technologies Austria AG
- KONCAR - ELECTRONICS AND INFORMATICS Inc.
- Silicongate LDA
- JLG Formations
- AEDVICES Consulting
- RUSZ - Verein zur Förderung der Sozialwirtschaft
- BK-Business Konsens OG
- CADENCE DESIGN SYSTEMS GMBH
- STMICROELECTRONICS (ALPS) SAS
- ONG "THE STERN STEWART INSTITUTE"/LYCEE PRIVE SHORGE
- Technische Universität Graz (Lead Partner)
Laufzeit | Oktober/2023 - September/2027 |
Projektleitung | |
Projektmitarbeiter*innen | |
Forschungsschwerpunkt | Bildungsforschung |
Studiengänge | |
Forschungsprogramm | DIGITAL-2022-SKILLS-03-SPECIALISED-EDU, DIGITAL-SIMPLE |
Förderinstitution/Auftraggeber |
The EU Chips Act aims to increase Europe‘s global production share of semiconductors to 20% by 2030, leading to a need for a skilled workforce to support this growth. Additionally, the EU‘s Green Deal initiative focuses on a transition to sustainable and energy efficient technologies, further emphasizing the need for expertise in sustainable chip development and green applications. There is an EU wide shortage of skilled workers in microelectronics. Addressing this shortage will be crucial in meeting the goals of both the EU Chips Act and the Green Deal. Furthermore, the next generation of students is largely interested in contributing to a sustainable environment. Providing them with the opportunity to gain deeper expertise in this field will align their skills with the industry‘s future needs. The proposed project „Green Chips-EDU“ supports the aforementioned goals by addressing the needs and challenges of a green and digital transition in the microelectronics industry. The consortium, made up of 15 key players from 7 EU countries, aims to build an attractive education ecosystem in green microelectronics by integrating the knowledge triangle of excellent education, industries needs and research challenges. The consortium includes 6 Unite! partners working on a harmonized curriculum focusing on energy efficiency and the development of sustainable integrated circuits. The project addresses all objectives from the call by offering a wide range of degree programs including mutual recognition as well as self-standing modules, implementing staff and student mobility, digital learning formats and upgrading infrastructure. About 600 students are planned to receive degrees or certificates in green electronics. In addition, summer schools, sustainability hackathons, learn-repair cafés as well as expert lectures by the partner companies and research institutions are organized to attract and train students to counteract the skills shortage in microelectronics in the EU.
- European Commission (Fördergeber/Auftraggeber)
- Politecnico Di Torino
- Technische Universität Darmstadt
- Universitat Politecnica de Catalunya
- Institut Polytechnique de Grenoble
- Instituto Superior Tecnico
- INESC ID
- Infineon Technologies Austria AG
- KONCAR - ELECTRONICS AND INFORMATICS Inc.
- Silicongate LDA
- JLG Formations
- AEDVICES Consulting
- RUSZ - Verein zur Förderung der Sozialwirtschaft
- BK-Business Konsens OG
- CADENCE DESIGN SYSTEMS GMBH
- STMICROELECTRONICS (ALPS) SAS
- ONG "THE STERN STEWART INSTITUTE"/LYCEE PRIVE SHORGE
- Technische Universität Graz (Lead Partner)
Laufzeit | Oktober/2023 - September/2027 |
Projektleitung | |
Projektmitarbeiter*innen | |
Forschungsschwerpunkt | Bildungsforschung |
Studiengänge | |
Forschungsprogramm | DIGITAL-2022-SKILLS-03-SPECIALISED-EDU, DIGITAL-SIMPLE |
Förderinstitution/Auftraggeber |
The EU Chips Act aims to increase Europe‘s global production share of semiconductors to 20% by 2030, leading to a need for a skilled workforce to support this growth. Additionally, the EU‘s Green Deal initiative focuses on a transition to sustainable and energy efficient technologies, further emphasizing the need for expertise in sustainable chip development and green applications. There is an EU wide shortage of skilled workers in microelectronics. Addressing this shortage will be crucial in meeting the goals of both the EU Chips Act and the Green Deal. Furthermore, the next generation of students is largely interested in contributing to a sustainable environment. Providing them with the opportunity to gain deeper expertise in this field will align their skills with the industry‘s future needs. The proposed project „Green Chips-EDU“ supports the aforementioned goals by addressing the needs and challenges of a green and digital transition in the microelectronics industry. The consortium, made up of 15 key players from 7 EU countries, aims to build an attractive education ecosystem in green microelectronics by integrating the knowledge triangle of excellent education, industries needs and research challenges. The consortium includes 6 Unite! partners working on a harmonized curriculum focusing on energy efficiency and the development of sustainable integrated circuits. The project addresses all objectives from the call by offering a wide range of degree programs including mutual recognition as well as self-standing modules, implementing staff and student mobility, digital learning formats and upgrading infrastructure. About 600 students are planned to receive degrees or certificates in green electronics. In addition, summer schools, sustainability hackathons, learn-repair cafés as well as expert lectures by the partner companies and research institutions are organized to attract and train students to counteract the skills shortage in microelectronics in the EU.
- European Commission (Fördergeber/Auftraggeber)
- Politecnico Di Torino
- Technische Universität Darmstadt
- Universitat Politecnica de Catalunya
- Institut Polytechnique de Grenoble
- Instituto Superior Tecnico
- INESC ID
- Infineon Technologies Austria AG
- KONCAR - ELECTRONICS AND INFORMATICS Inc.
- Silicongate LDA
- JLG Formations
- AEDVICES Consulting
- RUSZ - Verein zur Förderung der Sozialwirtschaft
- BK-Business Konsens OG
- CADENCE DESIGN SYSTEMS GMBH
- STMICROELECTRONICS (ALPS) SAS
- ONG "THE STERN STEWART INSTITUTE"/LYCEE PRIVE SHORGE
- Technische Universität Graz (Lead Partner)
Laufzeit | Oktober/2023 - September/2027 |
Projektleitung | |
Projektmitarbeiter*innen | |
Forschungsschwerpunkt | Bildungsforschung |
Studiengänge | |
Forschungsprogramm | DIGITAL-2022-SKILLS-03-SPECIALISED-EDU, DIGITAL-SIMPLE |
Förderinstitution/Auftraggeber |
The EU Chips Act aims to increase Europe‘s global production share of semiconductors to 20% by 2030, leading to a need for a skilled workforce to support this growth. Additionally, the EU‘s Green Deal initiative focuses on a transition to sustainable and energy efficient technologies, further emphasizing the need for expertise in sustainable chip development and green applications. There is an EU wide shortage of skilled workers in microelectronics. Addressing this shortage will be crucial in meeting the goals of both the EU Chips Act and the Green Deal. Furthermore, the next generation of students is largely interested in contributing to a sustainable environment. Providing them with the opportunity to gain deeper expertise in this field will align their skills with the industry‘s future needs. The proposed project „Green Chips-EDU“ supports the aforementioned goals by addressing the needs and challenges of a green and digital transition in the microelectronics industry. The consortium, made up of 15 key players from 7 EU countries, aims to build an attractive education ecosystem in green microelectronics by integrating the knowledge triangle of excellent education, industries needs and research challenges. The consortium includes 6 Unite! partners working on a harmonized curriculum focusing on energy efficiency and the development of sustainable integrated circuits. The project addresses all objectives from the call by offering a wide range of degree programs including mutual recognition as well as self-standing modules, implementing staff and student mobility, digital learning formats and upgrading infrastructure. About 600 students are planned to receive degrees or certificates in green electronics. In addition, summer schools, sustainability hackathons, learn-repair cafés as well as expert lectures by the partner companies and research institutions are organized to attract and train students to counteract the skills shortage in microelectronics in the EU.
- European Commission (Fördergeber/Auftraggeber)
- Politecnico Di Torino
- Technische Universität Darmstadt
- Universitat Politecnica de Catalunya
- Institut Polytechnique de Grenoble
- Instituto Superior Tecnico
- INESC ID
- Infineon Technologies Austria AG
- KONCAR - ELECTRONICS AND INFORMATICS Inc.
- Silicongate LDA
- JLG Formations
- AEDVICES Consulting
- RUSZ - Verein zur Förderung der Sozialwirtschaft
- BK-Business Konsens OG
- CADENCE DESIGN SYSTEMS GMBH
- STMICROELECTRONICS (ALPS) SAS
- ONG "THE STERN STEWART INSTITUTE"/LYCEE PRIVE SHORGE
- Technische Universität Graz (Lead Partner)
Laufzeit | Oktober/2023 - September/2027 |
Projektleitung | |
Projektmitarbeiter*innen | |
Forschungsschwerpunkt | Bildungsforschung |
Studiengänge | |
Forschungsprogramm | DIGITAL-2022-SKILLS-03-SPECIALISED-EDU, DIGITAL-SIMPLE |
Förderinstitution/Auftraggeber |
The EU Chips Act aims to increase Europe‘s global production share of semiconductors to 20% by 2030, leading to a need for a skilled workforce to support this growth. Additionally, the EU‘s Green Deal initiative focuses on a transition to sustainable and energy efficient technologies, further emphasizing the need for expertise in sustainable chip development and green applications. There is an EU wide shortage of skilled workers in microelectronics. Addressing this shortage will be crucial in meeting the goals of both the EU Chips Act and the Green Deal. Furthermore, the next generation of students is largely interested in contributing to a sustainable environment. Providing them with the opportunity to gain deeper expertise in this field will align their skills with the industry‘s future needs. The proposed project „Green Chips-EDU“ supports the aforementioned goals by addressing the needs and challenges of a green and digital transition in the microelectronics industry. The consortium, made up of 15 key players from 7 EU countries, aims to build an attractive education ecosystem in green microelectronics by integrating the knowledge triangle of excellent education, industries needs and research challenges. The consortium includes 6 Unite! partners working on a harmonized curriculum focusing on energy efficiency and the development of sustainable integrated circuits. The project addresses all objectives from the call by offering a wide range of degree programs including mutual recognition as well as self-standing modules, implementing staff and student mobility, digital learning formats and upgrading infrastructure. About 600 students are planned to receive degrees or certificates in green electronics. In addition, summer schools, sustainability hackathons, learn-repair cafés as well as expert lectures by the partner companies and research institutions are organized to attract and train students to counteract the skills shortage in microelectronics in the EU.
- European Commission (Fördergeber/Auftraggeber)
- Politecnico Di Torino
- Technische Universität Darmstadt
- Universitat Politecnica de Catalunya
- Institut Polytechnique de Grenoble
- Instituto Superior Tecnico
- INESC ID
- Infineon Technologies Austria AG
- KONCAR - ELECTRONICS AND INFORMATICS Inc.
- Silicongate LDA
- JLG Formations
- AEDVICES Consulting
- RUSZ - Verein zur Förderung der Sozialwirtschaft
- BK-Business Konsens OG
- CADENCE DESIGN SYSTEMS GMBH
- STMICROELECTRONICS (ALPS) SAS
- ONG "THE STERN STEWART INSTITUTE"/LYCEE PRIVE SHORGE
- Technische Universität Graz (Lead Partner)
Laufzeit | Oktober/2023 - September/2027 |
Projektleitung | |
Projektmitarbeiter*innen | |
Forschungsschwerpunkt | Bildungsforschung |
Studiengänge | |
Forschungsprogramm | DIGITAL-2022-SKILLS-03-SPECIALISED-EDU, DIGITAL-SIMPLE |
Förderinstitution/Auftraggeber |
The EU Chips Act aims to increase Europe‘s global production share of semiconductors to 20% by 2030, leading to a need for a skilled workforce to support this growth. Additionally, the EU‘s Green Deal initiative focuses on a transition to sustainable and energy efficient technologies, further emphasizing the need for expertise in sustainable chip development and green applications. There is an EU wide shortage of skilled workers in microelectronics. Addressing this shortage will be crucial in meeting the goals of both the EU Chips Act and the Green Deal. Furthermore, the next generation of students is largely interested in contributing to a sustainable environment. Providing them with the opportunity to gain deeper expertise in this field will align their skills with the industry‘s future needs. The proposed project „Green Chips-EDU“ supports the aforementioned goals by addressing the needs and challenges of a green and digital transition in the microelectronics industry. The consortium, made up of 15 key players from 7 EU countries, aims to build an attractive education ecosystem in green microelectronics by integrating the knowledge triangle of excellent education, industries needs and research challenges. The consortium includes 6 Unite! partners working on a harmonized curriculum focusing on energy efficiency and the development of sustainable integrated circuits. The project addresses all objectives from the call by offering a wide range of degree programs including mutual recognition as well as self-standing modules, implementing staff and student mobility, digital learning formats and upgrading infrastructure. About 600 students are planned to receive degrees or certificates in green electronics. In addition, summer schools, sustainability hackathons, learn-repair cafés as well as expert lectures by the partner companies and research institutions are organized to attract and train students to counteract the skills shortage in microelectronics in the EU.
- European Commission (Fördergeber/Auftraggeber)
- Politecnico Di Torino
- Technische Universität Darmstadt
- Universitat Politecnica de Catalunya
- Institut Polytechnique de Grenoble
- Instituto Superior Tecnico
- INESC ID
- Infineon Technologies Austria AG
- KONCAR - ELECTRONICS AND INFORMATICS Inc.
- Silicongate LDA
- JLG Formations
- AEDVICES Consulting
- RUSZ - Verein zur Förderung der Sozialwirtschaft
- BK-Business Konsens OG
- CADENCE DESIGN SYSTEMS GMBH
- STMICROELECTRONICS (ALPS) SAS
- ONG "THE STERN STEWART INSTITUTE"/LYCEE PRIVE SHORGE
- Technische Universität Graz (Lead Partner)
Artikel in Zeitschriften | ||
---|---|---|
Titel | Autor | Jahr |
A two-scale topology optimization method for functionally graded lattice structures using three families of micro-structures Computer-Aided Design and Applications, 21(2):179-198 | Ali, A., Faller, L., Gföhler, M., Riemelmoser, F., Kapl, M. | 2024 |
Adaptive methods with C1 splines for multi-patch surfaces and shells Computer Methods in Applied Mechanics and Engineering, 431(117287) | Bracco, C., Farahat, A., Giannelli, C., Kapl, M., Vazquez, R. | 2024 |
A locally based construction of analysis-suitable G1 multi-patch spline surfaces Computers & Mathematics with Applications, 168:46-57 | Farahat, A., Kapl, M., Kosmac, A., Vitrih, V. | 2024 |
C1-smooth isogeometric spline functions of general degree over planar mixed meshes: The case of two quadratic mesh elements Applied Mathematcis and Computation, 460(128278) | Groselj, J., Kapl, M., Knez, M., Takacs, T., Vitrih, V. | 2024 |
Isogeometric collocation for solving the biharmonic equation over planar multi-patch domains Computer Methods in Applied Mechanics and Engineering, 424(116882) | Kapl, M., Kosmac, A., Vitrih, V. | 2024 |
Adaptive isogeometric methods with C1 (truncated) hierarchical splines on planar multi-patch domains Mathematical Models and Methods in Applied Sciences, 33(9):1829-1874 | Bracco, C., Giannelli, C., Kapl, M., Vázquez, R. | 2023 |
Isogeometric analysis with C1-smooth functions over multi-patch surfaces Computer Methods in Applied Mechanics and Engineering, 403A(115706) | Farahat, A., Jüttler, B., Kapl, M., Takacs, T. | 2023 |
Isogeometric analysis for multi-patch structured Kichhoff-Love shells Computer Methods in Applied Mechanics and Engineering, 411(116060) | Farahat, A., Verhelst, H., Kiendl, J., Kapl, M. | 2023 |
C1 isogeometric spline space for trilinearly parameterized multi-patch volumes Computers & Mathematics with Applications, 117:53-68 | Kapl, M., Vitrih, V. | 2022 |
A family of C1 quadrilateral finite elements Advances in Computational Mathematics, 47:82 | Kapl, M., Sangalli, G., Takacs, T. | 2021 |
Cs-smooth isogeometric spline spaces over planar bilinear multi-patch parameterizations Advances in Computational Mathematics, 47:47 | Kapl, M., Vitrih, V. | 2021 |
Isogeometric analysis with C1 hierarchical functions on planar two-patch geometries Computers & Mathematics with Applications, 80(11):2538-2562 | Bracco, C., Giannelli, C., Kapl, M., Vazquez, R. | 2020 |
A super-smooth C1 spline space over planar mixed triangle and quadrilateral meshes Computers & Mathematics with Applications, 80(12):2623-2643 | Groselj, J., Kapl, M., Knez, M., Takacs, T., Vitrih, V. | 2020 |
Isogeometric collocation on planar multi-patch domains Computer Methods in Applied Mechanics and Engineering, 360:112684 | Kapl, M., Vitrih, V. | 2020 |
The space of C1-smooth isogeometric spline functions on trilinearly parameterized volumetric two-patch domains Computer Aided Geometric Design, 70:16-30 | Birner, K., Kapl, M. | 2019 |
An isogeometric C1 subspace on unstructured multi-patch planar domains Computer Aided Geometric Design, 69:55-75 | Kapl, M., Sangalli, G., Takacs, T. | 2019 |
Isogeometric analysis with C1 functions on planar, unstructured quadrilateral meshes The SMAI journal of computational mathematics, S5:67-86 | Kapl, M., Sangalli, G., Takacs, T. | 2019 |
Solving the triharmonic equation over multi-patch planar domains using isogeometric analysis Journal of Computational and Applied Mathematics, 358:385-404 | Kapl, M., Vitrih, V. | 2019 |
Construction of analysis-suitable G1 planar multi-patch parameterizations Computer-Aided Design, 97:41-55 | Kapl, M., Sangalli, G., Takacs, T. | 2018 |
Dimension and basis construction for C2-smooth isogeometric spline spaces over bilinear-like G2 two-patch parameterizations Journal of Computational and Applied Mathematics, 335:289-311 | Kapl, M., Vitrih, V. | 2018 |
Isogeometric analysis with geometrically continuous functions on planar multi-patch geometries Computer Methods in Applied Mechanics and Engineering, 316:209-234 | Kapl, M., Buchegger, F., Bercovier, M., Jüttler, B. | 2017 |
Dimension and basis construction for analysis-suitable G1 two-patch parameterizations Computer Aided Geometric Design, 52-53:75-89 | Kapl, M., Sangalli, G., Takacs, T. | 2017 |
Space of C2-smooth geometrically continuous isogeometric functions on planar multi-patch geometries: Dimension and numerical experiments Computers & Mathematics with Applications, 10(10):2319-2338 | Kapl, M., Vitrih, V. | 2017 |
Space of C2-smooth geometrically continuous isogeometric functions on two-patch geometries Computers & Mathematics with Applications, 73(1):37-59 | Kapl, M., Vitrih, V. | 2017 |
Isogeometric analysis with geometrically continuous functions on two-patch geometries Computers & Mathematics with Applications, 70(7):1518-1538 | Kapl, M., Vitrih, V., Jüttler, B., Birner, K. | 2015 |
Total curvature variation fairing for medial axis regularization Graphical Models, 76(6):633-647 | Buchegger, F., Jüttler, B., Kapl, M. | 2014 |
Isogeometric segmentation: The case of contractible solids without non-convex edges Computer-Aided Design, 57:74-90 | Jüttler, B., Kapl, M., Nguyen, D., Pan, Q., Michael, P. | 2014 |
Medial design of blades for hydroelectric turbines and ship propellers Computer & Graphics, 36(5):434-444 | Rossgatterer, M., Jüttler, B., Kapl, M., Della Vecchia, G. | 2012 |
Triangular bubble spline surfaces Computer-Aided Design, 43(11):1341-1349 | Kapl, M., Byrtus, M., Jüttler, B. | 2011 |
A multiresolution analysis for tensor-product splines using weighted spline wavelets Journal of Computational and Applied Mathematics, 231(2):828-839 | Kapl, M., Jüttler, B. | 2009 |
Konferenzbeiträge | ||
---|---|---|
Titel | Autor | Jahr |
Using scaled embedded distances to generate metrics for R2 in: Mathematics of Surfaces XIV, 11-13 Sep 2013, Birmingham, S. 63-83 | Kapl, M., Aurenhammer, F., Jüttler, B. | 2013 |
Voronoi Diagrams from (Possibly Discontinuous) Embeddings in: ISVD 2013 - 10th International Symposium on Voronoi Diagrams in Science and Engineering, 08-10 Jul 2013, St Petersburg, S. 47-50 | Kapl, M., Aurenhammer, F., Jüttler, B. | 2013 |
A multiresolution analysis for implicitly defined algebraic spline curves with weighted wavelets in: Nashboro Press (Hrsg.), Approximation Theory 12, 02-04 Mar 2007, San Antonio, S. 191-200 | Kapl, M., Jüttler, B. | 2007 |
Artikel in Zeitschriften | ||
---|---|---|
Titel | Autor | Jahr |
A two-scale topology optimization method for functionally graded lattice structures using three families of micro-structures Computer-Aided Design and Applications, 21(2):179-198 | Ali, A., Faller, L., Gföhler, M., Riemelmoser, F., Kapl, M. | 2024 |
Adaptive methods with C1 splines for multi-patch surfaces and shells Computer Methods in Applied Mechanics and Engineering, 431(117287) | Bracco, C., Farahat, A., Giannelli, C., Kapl, M., Vazquez, R. | 2024 |
A locally based construction of analysis-suitable G1 multi-patch spline surfaces Computers & Mathematics with Applications, 168:46-57 | Farahat, A., Kapl, M., Kosmac, A., Vitrih, V. | 2024 |
C1-smooth isogeometric spline functions of general degree over planar mixed meshes: The case of two quadratic mesh elements Applied Mathematcis and Computation, 460(128278) | Groselj, J., Kapl, M., Knez, M., Takacs, T., Vitrih, V. | 2024 |
Isogeometric collocation for solving the biharmonic equation over planar multi-patch domains Computer Methods in Applied Mechanics and Engineering, 424(116882) | Kapl, M., Kosmac, A., Vitrih, V. | 2024 |
Artikel in Zeitschriften | ||
---|---|---|
Titel | Autor | Jahr |
Adaptive isogeometric methods with C1 (truncated) hierarchical splines on planar multi-patch domains Mathematical Models and Methods in Applied Sciences, 33(9):1829-1874 | Bracco, C., Giannelli, C., Kapl, M., Vázquez, R. | 2023 |
Isogeometric analysis with C1-smooth functions over multi-patch surfaces Computer Methods in Applied Mechanics and Engineering, 403A(115706) | Farahat, A., Jüttler, B., Kapl, M., Takacs, T. | 2023 |
Isogeometric analysis for multi-patch structured Kichhoff-Love shells Computer Methods in Applied Mechanics and Engineering, 411(116060) | Farahat, A., Verhelst, H., Kiendl, J., Kapl, M. | 2023 |
Artikel in Zeitschriften | ||
---|---|---|
Titel | Autor | Jahr |
C1 isogeometric spline space for trilinearly parameterized multi-patch volumes Computers & Mathematics with Applications, 117:53-68 | Kapl, M., Vitrih, V. | 2022 |
Artikel in Zeitschriften | ||
---|---|---|
Titel | Autor | Jahr |
A family of C1 quadrilateral finite elements Advances in Computational Mathematics, 47:82 | Kapl, M., Sangalli, G., Takacs, T. | 2021 |
Cs-smooth isogeometric spline spaces over planar bilinear multi-patch parameterizations Advances in Computational Mathematics, 47:47 | Kapl, M., Vitrih, V. | 2021 |
Artikel in Zeitschriften | ||
---|---|---|
Titel | Autor | Jahr |
Isogeometric analysis with C1 hierarchical functions on planar two-patch geometries Computers & Mathematics with Applications, 80(11):2538-2562 | Bracco, C., Giannelli, C., Kapl, M., Vazquez, R. | 2020 |
A super-smooth C1 spline space over planar mixed triangle and quadrilateral meshes Computers & Mathematics with Applications, 80(12):2623-2643 | Groselj, J., Kapl, M., Knez, M., Takacs, T., Vitrih, V. | 2020 |
Isogeometric collocation on planar multi-patch domains Computer Methods in Applied Mechanics and Engineering, 360:112684 | Kapl, M., Vitrih, V. | 2020 |
Artikel in Zeitschriften | ||
---|---|---|
Titel | Autor | Jahr |
The space of C1-smooth isogeometric spline functions on trilinearly parameterized volumetric two-patch domains Computer Aided Geometric Design, 70:16-30 | Birner, K., Kapl, M. | 2019 |
An isogeometric C1 subspace on unstructured multi-patch planar domains Computer Aided Geometric Design, 69:55-75 | Kapl, M., Sangalli, G., Takacs, T. | 2019 |
Isogeometric analysis with C1 functions on planar, unstructured quadrilateral meshes The SMAI journal of computational mathematics, S5:67-86 | Kapl, M., Sangalli, G., Takacs, T. | 2019 |
Solving the triharmonic equation over multi-patch planar domains using isogeometric analysis Journal of Computational and Applied Mathematics, 358:385-404 | Kapl, M., Vitrih, V. | 2019 |
Construction of analysis-suitable G1 planar multi-patch parameterizations Computer-Aided Design, 97:41-55 | Kapl, M., Sangalli, G., Takacs, T. | 2018 |
Dimension and basis construction for C2-smooth isogeometric spline spaces over bilinear-like G2 two-patch parameterizations Journal of Computational and Applied Mathematics, 335:289-311 | Kapl, M., Vitrih, V. | 2018 |
Isogeometric analysis with geometrically continuous functions on planar multi-patch geometries Computer Methods in Applied Mechanics and Engineering, 316:209-234 | Kapl, M., Buchegger, F., Bercovier, M., Jüttler, B. | 2017 |
Dimension and basis construction for analysis-suitable G1 two-patch parameterizations Computer Aided Geometric Design, 52-53:75-89 | Kapl, M., Sangalli, G., Takacs, T. | 2017 |
Space of C2-smooth geometrically continuous isogeometric functions on planar multi-patch geometries: Dimension and numerical experiments Computers & Mathematics with Applications, 10(10):2319-2338 | Kapl, M., Vitrih, V. | 2017 |
Space of C2-smooth geometrically continuous isogeometric functions on two-patch geometries Computers & Mathematics with Applications, 73(1):37-59 | Kapl, M., Vitrih, V. | 2017 |
Isogeometric analysis with geometrically continuous functions on two-patch geometries Computers & Mathematics with Applications, 70(7):1518-1538 | Kapl, M., Vitrih, V., Jüttler, B., Birner, K. | 2015 |
Total curvature variation fairing for medial axis regularization Graphical Models, 76(6):633-647 | Buchegger, F., Jüttler, B., Kapl, M. | 2014 |
Isogeometric segmentation: The case of contractible solids without non-convex edges Computer-Aided Design, 57:74-90 | Jüttler, B., Kapl, M., Nguyen, D., Pan, Q., Michael, P. | 2014 |
Medial design of blades for hydroelectric turbines and ship propellers Computer & Graphics, 36(5):434-444 | Rossgatterer, M., Jüttler, B., Kapl, M., Della Vecchia, G. | 2012 |
Triangular bubble spline surfaces Computer-Aided Design, 43(11):1341-1349 | Kapl, M., Byrtus, M., Jüttler, B. | 2011 |
A multiresolution analysis for tensor-product splines using weighted spline wavelets Journal of Computational and Applied Mathematics, 231(2):828-839 | Kapl, M., Jüttler, B. | 2009 |
Konferenzbeiträge | ||
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Titel | Autor | Jahr |
Using scaled embedded distances to generate metrics for R2 in: Mathematics of Surfaces XIV, 11-13 Sep 2013, Birmingham, S. 63-83 | Kapl, M., Aurenhammer, F., Jüttler, B. | 2013 |
Voronoi Diagrams from (Possibly Discontinuous) Embeddings in: ISVD 2013 - 10th International Symposium on Voronoi Diagrams in Science and Engineering, 08-10 Jul 2013, St Petersburg, S. 47-50 | Kapl, M., Aurenhammer, F., Jüttler, B. | 2013 |
A multiresolution analysis for implicitly defined algebraic spline curves with weighted wavelets in: Nashboro Press (Hrsg.), Approximation Theory 12, 02-04 Mar 2007, San Antonio, S. 191-200 | Kapl, M., Jüttler, B. | 2007 |